Low dielectric adhesive AF-700 film type for electronic materials/substrates
Aromite AF-700 ◆ A bonding film that combines top-class low dielectric properties and excellent adhesion in the industry. Ideal for bonding high-speed transmission substrate materials!
The "Aromite(R) AF-700 series" is a thermosetting bonding film that exhibits low dielectric properties in the high-frequency range (1-10GHz). Compared to conventional epoxy-based bonding films, it has lower dielectric constant and dielectric loss tangent, making it suitable for electronic material applications that require high frequency performance. It has good adhesion to substrates that are generally considered difficult to bond, such as polyimide and LCP, and also excels in processability during circuit board manufacturing. It has received high praise from circuit board material manufacturers and film manufacturers both domestically and internationally. It is used in mobile circuit boards, including smartphones, as well as in automotive millimeter-wave radar and antenna components for base stations.
- Company：東亞合成 新製品開発事業部 機能性接着剤部
- Price：Other
